11/18/2023 0 Comments Download 2n3906 for freeSemiconductor Components Industries, LLC, 2 February, 2 Rev. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Indicates Data in addition to JEDEC Requirements STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL AMMO PACK MARKING DIAGRAM 2N 396 ALYW A = Assembly Location L = Wafer Lot Y = Year W = Work Week = PbFree Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Functional operation above the Recommended Operating Conditions is not implied. mw mw/ C TO92 CASE 29 STYLE 1 2 BASE 1 EMITTER Total Power T A = 6 C P D 2 mw Total Device T C = 2 C Derate above 2 C Operating and Storage Junction Temperature Range P D W mw/ C T J, T stg to +1 C THERMAL CHARACTERISTICS (Note 1) Characteristic Symbol Max Unit Thermal Resistance, JunctiontoAmbient R JA 2 C/W Thermal Resistance, JunctiontoCase R JC 83.3 C/W Stresses exceeding Maximum Ratings may damage the device. Vdc Collector Current Continuous I C 2 madc Total Device T A = 2 C Derate above 2 C P D 62. 1 2N396 General Purpose Transistors PNP Silicon Features PbFree Packages are Available* COLLECTOR 3 MAXIMUM RATINGS Rating Symbol Value Unit Collector Emitter Voltage V CEO 4 Vdc Collector Base Voltage V CBO 4 Vdc Emitter Base Voltage V EBO.
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